从Fraunhofer ISE剥离出的NexWafe公司，已获得了800万美元的融资，用于其Kerfless晶片的商业化。
这些资金将用于NexWafe在德国弗莱堡生产基地中5兆瓦硅片生产线的调试，其目标是使产品成本降低50%，且将能源消耗也降低一半。该公司认为这一产品具有巨大的市场潜力。
公司CEOStefan Reber表示，试点生产线有望在2018年Q2完成。在试点生产线上线运行之后，该公司将寻求下一阶段的融资。他认为大规模生产设施所需的投资应该在5000-6000万欧元之间，而Kerfless硅片的众多优势，将有助于未来融资的获得。
Nexwafe的EpiWafer工艺技术，以一步主要硅沉积步骤取代了硅片生产中的四个步骤，带来了整个流程的高资源效率。
公司目前专注于硅片市场，但也将开始着眼于高效单晶硅片这一“增长最迅速的领域。”
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